Did you know that the technology behind umami seasoning is inside your computer and smartphone?

Ajinomoto, known worldwide as a food company, actually commands nearly 100% of the global market share for semiconductor insulating materials. Their product, called "Ajinomoto Build-up Film (ABF)," has become the industry standard adopted by every major semiconductor manufacturer including Intel, AMD, and NVIDIA.

How did a food company become essential to the heart of semiconductors? The answer lies in an unexpected story of technology that evolved from amino acid manufacturing.

Why a Food Company Makes Semiconductor Materials

The combination of Ajinomoto and semiconductor materials seems puzzling at first. However, tracing its history reveals a natural progression.

In the 1960s, Ajinomoto manufactured monosodium glutamate, the umami component, through organic synthesis. To make use of byproducts and intermediates from this process, the company began developing chemical products such as epoxy resin hardeners and flame retardants. This was the origin of Ajinomoto Fine-Techno.

By the 1970s, they had started basic research on insulating epoxy resins, applying their amino acid expertise. Then in the 1990s, as demand for insulating materials for semiconductor package substrates grew alongside PC advancement, Ajinomoto took on the challenge of developing the industry's first film-type insulating material.

Why ABF Revolutionized the Industry

Before ABF, insulating semiconductor substrates required applying liquid resin and drying it one side at a time, a labor-intensive process. Ajinomoto's research team challenged themselves to convert this liquid into film form.

The impact was tremendous. The process was simplified to just sandwiching the substrate between two films using vacuum lamination. This dramatically reduced the number of steps while producing uniformly smooth surfaces. What's fascinating is the uniquely food-company approach: the idea of coating varnish onto film and "shipping it frozen" was something the semiconductor industry never imagined.

Since its adoption by major semiconductor manufacturers in 1999, ABF has continuously evolved alongside circuit miniaturization. Today, it holds nearly 100% of the global market share for high-performance PC insulating materials.

The "Secret Sauce" Formulation Technology

ABF's competitive edge lies in its proprietary technology for blending more than 10 types of raw materials. The formula combining organic epoxy resins, hardeners, and inorganic filler particles is internally called the "secret sauce."

Organic and inorganic materials typically don't mix well, but Ajinomoto applied mixing and dispersion techniques cultivated through years of food research to achieve both uniform insulation and excellent processability. This formulation expertise, combined with close customer collaboration and solution-oriented proposals, creates high barriers to competitor entry.

Expansion into Low-Temperature Curing Adhesives: Plainset

In January 2026, Ajinomoto Fine-Techno exhibited their industrial adhesive material "Plainset" at the 40th NEPCON Japan. This product also leverages their amino acid expertise.

Plainset's key feature is its ability to cure at temperatures as low as 80°C. While conventional epoxy adhesives require high-temperature curing, Plainset can handle assembly of heat-sensitive electronic components. At temperatures of 120°C to 150°C, it achieves curing in just seconds, dramatically improving production efficiency.

Low-temperature curing offers another crucial benefit. Adhesives cured at high temperatures generate stress when materials contract during cooling. Low-temperature curing minimizes this stress, contributing to long-term product reliability.

Fujifilm: Another Japanese Success Story in Technology Pivot

Ajinomoto's case draws attention as a successful example of Japanese corporate technology transfer. Fujifilm achieved similar success.

When facing the crisis of plummeting photographic film demand, Fujifilm thoroughly inventoried the technologies they'd developed. Collagen, the main ingredient in photographic film, also maintains skin elasticity. The anti-oxidation technology preventing film degradation could be applied to anti-aging skincare.

Through this redefinition of their technology, Fujifilm successfully launched "ASTALIFT" cosmetics and regenerative medicine businesses, transforming from a photography company into a total healthcare company.

Growing Importance of ABF in the AI Era

With AI development and data center demand expanding, high-performance semiconductor demand is surging. Server, data center, and AI substrates can have 3.5 times the board area and three times the layer count compared to PC versions, and ABF usage is expected to increase more than tenfold.

Predictions suggest the market could reach approximately 1.2 trillion yen by 2030, and Ajinomoto is accelerating capital investment ahead of schedule. Meanwhile, challengers like US startup Thintronics are emerging to take on Ajinomoto's dominant position.

From Food to Semiconductors: The Power of Understanding Technology's Essence

Ajinomoto's success lies in discerning the essence of existing technologies and exploring applications in new markets. Chemical expertise born from umami seasoning production now supports critical infrastructure in today's digital society.

Ajinomoto's purpose is to "contribute to the well-being of all human beings, our society, and our planet through AminoScience®." Food and electronic materials, seemingly disparate businesses, are actually connected through the common technological foundation of amino acids. This "invisible technological continuity" is the source of the company's strength.

In Japan, people express surprise and pride that a food manufacturer like Ajinomoto supports cutting-edge technology. Are there companies in your country that are active in unexpected fields? What do you think about the fusion of food and semiconductors? Please share your thoughts in the comments!

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