Glass TGV Drilling: A Japanese Laser Punches 3,000 Chip Holes a Second
RIKEN and Enplas drill 1.1-micron, aspect-ratio-1,000 holes through glass in under a nanosecond, hitting 3,000 holes a second. As the chip race shifts from shrinking to packaging, here's why glass through-glass vias matter, and where Japan's materials and equipment makers fit.