On July 15, 2026, Nvidia's Jensen Huang stood in a Tokyo arcade and thanked Sega for the $5 million that saved his company in the 1990s. The story ran everywhere. What almost nobody mentioned: the executive being thanked had helped pick the technology that failed.
Resonac, BEAM and Nippon LEO signed an MOU to manufacture compound semiconductors in low Earth orbit. Why build chips in microgravity, and how Japan's bet compares to the US and China.
Glass is the front-runner for AI chip packaging substrates, but its smooth surface won't hold wiring. Nikon's new PAP material uses light to solve it. A look at the hidden Japanese chokepoints in the chip-substrate supply chain.
Tokyo's Orbray and De Beers' Element Six have established a reproducible process for one of the largest single-crystal diamond wafers yet, at three inches. How a sapphire trick beat the cracking problem that long held back diamond, the material many call the ultimate semiconductor.
TSMC, the world's largest foundry, is quitting GaN power-chip manufacturing. ROHM, which built its flagship 650V parts inside TSMC's fabs, has licensed the technology and is racing to mass-produce in Hamamatsu by 2027. A look at the China-US rivalry and Japan's vertical-integration bet.
A team led by Japan's QST has shown, for the first time, a magnetic memory that writes with a laser pulse instead of current — and made it work on CoFeB, the alloy already inside commercial chips. Here's how, and why it matters for data-center power.
RIKEN and Enplas drill 1.1-micron, aspect-ratio-1,000 holes through glass in under a nanosecond, hitting 3,000 holes a second. As the chip race shifts from shrinking to packaging, here's why glass through-glass vias matter, and where Japan's materials and equipment makers fit.
Tokyo Ohka Kogyo is No. 1 in photoresist with a 24.7% share and No. 2 in EUV resist with 28%. How a 1936 maker of coal-lamp battery material became a chokepoint in the AI chip supply chain.
Intel switched on the world's first High-NA EUV machine; TSMC skipped the $400M tool. Being slow to the newest lithography once cost Intel a lost decade. Is TSMC repeating that mistake? Its confidence rests on Japan: Mitsui Chemicals' EUV pellicle and the HOYA/Shin-Etsu/AGC mask-blank near-monopoly (about 90% share).
Mitsui Chemicals was first in the world to mass-produce the EUV pellicle, a free-standing film tens of nanometers thick. From the ASML license to the carbon-nanotube pivot and a 2027 upgrade, here is why one invisible bottleneck sits with a single Japanese plant.
Not TSMC, not ASML. A Japanese chemical maker with ~$240M in sales quietly supplies about 70% of the world's photoresist sensitizer—the ingredient inside the ingredient that prints every advanced chip.