Resonac, BEAM and Nippon LEO signed an MOU to manufacture compound semiconductors in low Earth orbit. Why build chips in microgravity, and how Japan's bet compares to the US and China.
Japan's government just promised over 370 trillion yen ($2.3 trillion) across 17 strategic sectors by 2040. We unpack the suspicious arithmetic: a 6.5x return promised on chips, an undisclosed public-private split, and a deadline conveniently 14 years away.
Glass is the front-runner for AI chip packaging substrates, but its smooth surface won't hold wiring. Nikon's new PAP material uses light to solve it. A look at the hidden Japanese chokepoints in the chip-substrate supply chain.
Tokyo's Orbray and De Beers' Element Six have established a reproducible process for one of the largest single-crystal diamond wafers yet, at three inches. How a sapphire trick beat the cracking problem that long held back diamond, the material many call the ultimate semiconductor.
TSMC, the world's largest foundry, is quitting GaN power-chip manufacturing. ROHM, which built its flagship 650V parts inside TSMC's fabs, has licensed the technology and is racing to mass-produce in Hamamatsu by 2027. A look at the China-US rivalry and Japan's vertical-integration bet.
RIKEN and Enplas drill 1.1-micron, aspect-ratio-1,000 holes through glass in under a nanosecond, hitting 3,000 holes a second. As the chip race shifts from shrinking to packaging, here's why glass through-glass vias matter, and where Japan's materials and equipment makers fit.
A Japan-US team from Tohoku University and the US NIST built the first working spintronics probabilistic bit (P-bit) on a single silicon substrate using standard chip-fabrication processes. We explain the coin-flip idea, how it differs from quantum computing (room temperature, existing chip lines), and how far it really is from a product.
Sony Semiconductor Solutions is mass-producing the IMX711, a direct-conversion X-ray CMOS image sensor based on a pixel structure invented at Japan's RIKEN institute. With an industry-fastest 26,100fps and noise low enough to measure single X-ray photons, it ends a decades-old trade-off in X-ray imaging. Here's why battery makers, chip fabs and scientists are paying attention.
A ball bearing with a 0.6mm bore, smaller than a sesame seed. One firm in a former coal town in Hokkaido reportedly makes around 70% of the world's sub-millimeter bearings. Here's how.
Tokyo Ohka Kogyo is No. 1 in photoresist with a 24.7% share and No. 2 in EUV resist with 28%. How a 1936 maker of coal-lamp battery material became a chokepoint in the AI chip supply chain.
Intel switched on the world's first High-NA EUV machine; TSMC skipped the $400M tool. Being slow to the newest lithography once cost Intel a lost decade. Is TSMC repeating that mistake? Its confidence rests on Japan: Mitsui Chemicals' EUV pellicle and the HOYA/Shin-Etsu/AGC mask-blank near-monopoly (about 90% share).
Mitsui Chemicals was first in the world to mass-produce the EUV pellicle, a free-standing film tens of nanometers thick. From the ASML license to the carbon-nanotube pivot and a 2027 upgrade, here is why one invisible bottleneck sits with a single Japanese plant.
Not TSMC, not ASML. A Japanese chemical maker with ~$240M in sales quietly supplies about 70% of the world's photoresist sensitizer—the ingredient inside the ingredient that prints every advanced chip.
JX Advanced Metals, maker of roughly 60% of the world's sputtering targets, is investing about 23 billion yen to expand its Hitachinaka plant by 1.6x and selling its Chilean copper mine stake to Lundin Mining for $215 million, redirecting the cash into chip materials. A look at a 120-year-old miner remaking itself as an advanced-materials company.
A fresh 150-billion-yen government injection pushes the state's share of Rapidus's capital to roughly 60%. Yet Tokyo capped its voting rights at 11.5%, keeping the firm out of state-enterprise territory by design. We unpack subsidies versus equity, the fate of the 2nm skeptics, and the question of who will actually buy the chips.
ROHM and Quanmatic put quantum annealing to work on a chip fab's front-end process, lifting output about 3%. Here's why a number that sounds small is actually a big deal on a factory floor.
The world's first factory built to mass-produce diamond semiconductors has opened in Okuma, the Fukushima town that hosts the wrecked Daiichi nuclear plant. How a material researchers chased for 40 years found its purpose in the place that needed it most.
Ultra-pure water is the invisible backbone of chipmaking, so clean that a stadium of it may hold less impurity than a single sugar cube. Three Japanese firms, Kurita, Organo and Nomura Micro Science, lead the world. We unpack their technical edge and the contest with global rivals like Veolia.
Asahi Kasei has developed a photosensitive polyimide film for advanced semiconductor packaging—turning a liquid material into a laminated film, the same playbook behind ABF. We explain what it means for AI chiplet packaging, how it stacks up against US and Korean rivals, and why Japan keeps winning the materials game.
An Osaka University team has shrunk a key step in magnetic tunnel junction fabrication from hours to about 1.7 seconds using flash-lamp annealing—up to thousands of times faster than conventional methods, with implications for MRAM mass production and flexible sensors.