Renesas Electronics' Intersil-brand radiation-hardened ICs are aboard NASA's Artemis 2 crewed lunar mission, powering critical subsystems in the Orion spacecraft and SLS rocket. Discover the 60+ year heritage behind these space-grade chips and what Japan's role in the $1.8 billion rad-hard semiconductor market means for the future of space exploration.
UK activist fund Palliser Capital has become a top-25 shareholder of Ajinomoto and is demanding a 30%+ price increase for its ABF semiconductor insulation material. We explore how a food company holds near-100% global market share in chip packaging and what the activist wave means for Japanese corporations.
Japan's AIST has established ASiST, a new consortium bridging chip design, front-end, mid-process, back-end, and packaging. Learn how it fits into Japan's semiconductor revival alongside Rapidus and competes with U.S. and EU chip strategies.
Rohm has achieved its NEDO-funded technical target for 8-inch SiC MOSFETs two years ahead of schedule, demonstrating over 50% power loss reduction versus conventional silicon IGBTs. We explore what this means for EVs, renewable energy, and Japan's power semiconductor consolidation race involving Toshiba, Mitsubishi Electric, and Denso.
Fujitsu will develop a fully domestic AI semiconductor (NPU) using 1.4nm process technology, with manufacturing outsourced to Japan's national chipmaker Rapidus. Backed by Japan's Ministry of Economy, the move leverages supercomputer Fugaku's energy-efficient technology. We analyze Japan's semiconductor revival strategy vs. the US CHIPS Act, EU Chips Act, and Korea's K-Chips initiative.
Rapidus CTO Kazunari Ishimaru says Japan's startup chipmaker aims to close the technology gap with TSMC to just six months at the 1nm generation. We analyze Rapidus' 2nm mass production timeline, IBM partnership, Hokkaido fab progress, $19B in government backing, and Japan's chances of rejoining the cutting-edge semiconductor race.
Japan's Rohm, Toshiba, and Mitsubishi Electric have announced merger talks for their power semiconductor businesses. If realized, the combined entity would hold ~10% global market share, ranking second only to Germany's Infineon. We analyze the Denso $8.3B counter-bid, EV and renewable energy demand, and what this means for global chip competition.
Shinko Electric Industries is entering the photonic-electronic convergence manufacturing market as an OSAT, targeting CPO projects that TSMC won't take. With expertise in advanced packaging and optical alignment, this Japanese company aims to become the go-to manufacturer for Co-Packaged Optics — the technology set to slash AI data center power consumption by half. We break down the CPO race, NTT's IOWN initiative, and why NVIDIA, Intel, and AMD are all betting on light.
Japan is seeing new momentum in chip design. Fabless startups like TRIPLE-1 and Socionext challenge Chinese giant Bitmain's dominance in mining ASICs. We explore Japan's emerging role in chip design, Rapidus's 2nm mass production plans, TSMC partnerships, and positioning amid the US-China semiconductor rivalry.
Kioxia has developed foundational 3D DRAM technology using IGZO oxide semiconductors, signaling the NAND-only maker's bold entry into the DRAM market. Behind this challenge: exploding AI demand and the physical limits of current memory. We break down the competition with Samsung, SK hynix, and China's CXMT.
Rapidus's AI design agent 'Raads' is already in use by 3 companies — 2 domestic, 1 overseas. This LLM-based EDA suite enables natural language chip design, cutting design time by 50% and costs by 30%. We compare it with TSMC and Intel's AI tools and examine Rapidus's path to 2nm mass production.
