Sony Semiconductor Solutions has signed an MOU with TSMC to form a next-generation image sensor joint venture. Why is the 51% market leader pairing with Taiwan instead of going it alone? We compare it with the US CHIPS Act, EU Chips Act, and Korea's K-Chips Act, and explore the Apple-Samsung tug-of-war shaping the physical-AI era.
GPU-to-GPU optical interconnects were forecast to arrive around 2033. NVIDIA just pulled them in by five years, announcing they will ship in the 2028 Feynman GPU generation. As Co-Packaged Optics (CPO) hits mass production, Furukawa Electric is investing 38 billion yen to quintuple its DFB laser output, while Sumitomo Electric supplies critical components for NVIDIA's Quantum-X Photonics switches. We unpack the high-stakes race between NVIDIA, Broadcom, Intel, and NTT's IOWN — and where Japan's optical suppliers stand in it.
Kioxia and Sandisk have achieved a world-first technological milestone toward 3D NAND flash memory exceeding 1,000 layers. Their multi-stacked cell array CMOS (MSA-CBA) structure with wafer-to-wafer Cu direct bonding successfully demonstrated QLC operation, and will be unveiled at the VLSI Symposium 2026 in Hawaii this June. We break down the technology, the three-way stacking race against Samsung, SK hynix, and Micron, and what soaring AI data center demand means for the NAND market.
Kao, famous for Biore and Attack, has launched its first overseas semiconductor cleaning center in Taiwan. Ajinomoto, the MSG maker, is pouring over 25 billion yen into ABF insulation films that hold nearly 100% global share. We explain how Japanese consumer goods companies—alongside Shin-Etsu, SUMCO, JSR, and TOK—became indispensable to the AI chip supply chain, and how they compete with US, European, Korean, and Taiwanese rivals.
Just three days after Denso's withdrawal, Mitsubishi Electric CEO Kei Urutsuma declared he wants to spin off only the power semiconductor businesses of all three companies and form a joint venture. This proposes a different framework from Rohm and Toshiba's full semiconductor integration plan, adding a new wrinkle to the world No.2 alliance vision. We analyze competition with Wolfspeed, Infineon, and STMicroelectronics, the SiC market share battle, and the impact on the EV industry.
Fujitsu is doubling down on its sovereign AI strategy with the FUJITSU-MONAKA CPU series, choosing Rapidus as a manufacturing partner and 'coexisting' with NVIDIA's GPUs rather than competing. We compare Japan's hybrid approach to China's fully autonomous Loongson (LoongArch) and Europe's Arm-based SiPearl, revealing how Japan's pragmatic balance defines a third path in global chip sovereignty.
Kumamoto Prefecture, Koshi City and Mitsui Fudosan signed a partnership agreement on April 27 to launch a 31-hectare 'Kumamoto Science Park' core hub — modeled on Taiwan's Hsinchu — to anchor Japan's semiconductor revival around TSMC's 3nm Kumamoto fab by 2030. We compare it with the US CHIPS Act and EU Chips Act, and unpack the land-price spikes and labor crunch already reshaping the region.
Resonac, the world's top supplier of back-end semiconductor materials, has fully launched US-JOINT, a 12-company Japan-US consortium R&D center in Union City, California. The goal: cut proof-of-concept cycles from six months to one, and plug directly into the custom AI chip development of GAFAM-class hyperscalers.
Three weeks after the March 27 three-way merger announcement, Japan's power semiconductor reshuffle has accelerated. Denso declared its semiconductor-maker ambitions in CORE 2030, Rohm's CEO asserted leadership, Toshiba eyes re-listing, and Mitsubishi Electric opened a new Fukuoka plant. A timeline update.
Tokyo-based Orbray has produced the world's largest 30mm square (111) freestanding diamond single-crystal substrate, leaping from the previous few-millimeter limit. The twin-suppression breakthrough, published in Applied Physics Express, unlocks NV-center quantum sensors and next-generation power semiconductors.
Japan's METI officially approved an additional $4 billion for Rapidus, bringing total government support to $15 billion. We analyze Japan's 2nm chip ambitions alongside the US CHIPS Act, EU Chips Act, TSMC's Kumamoto expansion, and the critical challenge of finding customers.