Kioxia has developed foundational 3D DRAM technology using IGZO oxide semiconductors, signaling the NAND-only maker's bold entry into the DRAM market. Behind this challenge: exploding AI demand and the physical limits of current memory. We break down the competition with Samsung, SK hynix, and China's CXMT.
Rapidus's AI design agent 'Raads' is already in use by 3 companies — 2 domestic, 1 overseas. This LLM-based EDA suite enables natural language chip design, cutting design time by 50% and costs by 30%. We compare it with TSMC and Intel's AI tools and examine Rapidus's path to 2nm mass production.
Power Diamond Systems demonstrated the world's first actual power conversion using a diamond MOSFET in a DC-DC converter circuit. Following their recent 200V/1A switching milestone, this breakthrough advances diamond semiconductors from device-level testing to real circuit operation.
Seiko Epson and Taiwan's Manz Asia have formed a strategic partnership to develop inkjet-based semiconductor manufacturing. Their 'additive' approach prints functional materials directly onto substrates without photomasks, cutting costs and environmental impact versus traditional photolithography. We explore their Lab-to-Fab equipment roadmap and Japan's edge in printed electronics.
Japan's Power Diamond Systems, a Waseda University spinoff, achieved the world's first 200V/1A switching operation with a diamond MOSFET. With 550V breakdown voltage and 0.8A drain current in a single device, diamond semiconductors could surpass SiC and GaN as the ultimate power semiconductor for EVs and renewable energy.
Oxide Corporation, an optical crystal maker in Hokuto, Yamanashi, began selling Frequad-K, a 302nm UV laser source for quantum computers, on March 9, 2026. The wavelength is what excites ytterbium atoms into the Rydberg states neutral-atom machines need, and the first unit went to a domestic customer. We look at why 95% world share in semiconductor wafer inspection crystals transfers to quantum, and at the 436nm quantum communications laser Oxide shipped to LQUOM in July.
Japan's government has set an ambitious target of ¥40 trillion ($260B) in domestic semiconductor sales by 2040, announcing plans for cutting-edge AI research hubs. From Rapidus's 2nm chips in Hokkaido to TSMC's $17B 3nm fab in Kumamoto and JDI's $13B US display plant, we break down Japan's full semiconductor strategy—and compare it with the US CHIPS Act, EU Chips Act, and South Korea's and Taiwan's chip policies.
Kioxia's Q4 net profit surged 17x year-over-year as NAND flash prices skyrocket. AI-driven demand for HBM is squeezing memory supply for smartphones, PCs, and automobiles — creating a global shortage that may last until 2028. We analyze the competitive landscape with Samsung, SK Hynix, and Micron, and Kioxia's post-IPO growth strategy including its NVIDIA partnership for next-gen AI SSDs.
Denso proposed a tender offer for Rohm worth up to 1.3 trillion yen (about $8.2 billion), then withdrew it in April 2026 after Rohm's special committee declined to endorse the deal. Consolidation has shifted to a Rohm-Toshiba-Mitsubishi Electric alliance. Here is the competitive picture against Infineon, onsemi, and China's fast-rising players.
On February 27, 2026, Dai Nippon Printing announced an investment in Rapidus aimed at developing and scaling EUV photomasks for the 2nm generation. Here is DNP's role in the NEDO programme, its three multi-beam mask writers, the roadmap toward mass production in fiscal 2027, its High-NA EUV work for 1.4nm, and how the Japanese supply chain splits between DNP, Tecsend and HOYA.
Japan reveals the full picture of its Rapidus investment scheme: becoming top shareholder with just 10% voting rights, holding golden shares with veto power, and a mechanism to seize majority control if finances deteriorate. We compare Japan's $19B commitment with the US CHIPS Act and EU Chips Act, and examine whether Rapidus can realistically mass-produce 2nm chips by 2027.