Semiconductor Industry

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Technology

Semiconductor Equipment: How Japanese Companies Are Expanding Global Market Share in the AI Era

Japanese semiconductor equipment makers are expanding their global presence amid the AI chip boom. Tokyo Electron dominates coater/developers with 90%+ share, SCREEN leads wafer cleaning, and Advantest tops semiconductor testing. We analyze how Japanese firms leverage precision manufacturing to thrive in a market projected to reach $156 billion by 2027—and the challenges they face from US and European rivals.

Technology

Diamond Semiconductors: Japan's HORIBA Acquires Indian Lab-Grown Diamond Startup to Advance "Ultimate" Chip Material

Kyoto-based precision instrument maker HORIBA has acquired Indian startup Pristine Deeptech to accelerate diamond wafer commercialization. Diamond is called the "ultimate semiconductor material" with properties far surpassing silicon. Learn about HORIBA's strategy to build an R&D hub in India for next-generation power semiconductors and quantum sensors.

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Technology

SiC Semiconductors for Extreme Environments: Hiroshima University's Tech Enabling Venus Exploration and Nuclear Decommissioning

Hiroshima University and Phenitec Semiconductor achieved the world's first SiC integrated circuit prototype production in a commercial fab. This revolutionary semiconductor technology operates at 500°C and under high radiation, enabling applications in extreme environments like Venus surface exploration and Fukushima nuclear decommissioning—expanding humanity's frontier through Japanese innovation.

Technology

MoS2 Wafer-Scale Deposition: Japan's NIMS Breakthrough Paves Way for Sub-1nm Transistors

NIMS and University of Tokyo researchers have developed a revolutionary wafer-scale deposition technology for next-generation semiconductor material MoS2 (molybdenum disulfide). By discovering two key growth mechanisms, self-alignment and self-limiting, they achieved uniform, high-quality monolayer films across entire 2-inch wafers. This breakthrough opens the path to post-silicon semiconductors for sub-1nm node transistors.