Advanced materials, chemicals, fibers and ceramics.
Glass is the front-runner for AI chip packaging substrates, but its smooth surface won't hold wiring. Nikon's new PAP material uses light to solve it. A look at the hidden Japanese chokepoints in the chip-substrate supply chain.
Kubota says its existing waste-melting furnaces destroyed three regulated PFAS at over 99.999 percent, with greenhouse-gas markers below detection. We check whether 'destroying forever chemicals' is really the breakthrough it sounds like.
Tokyo's Orbray and De Beers' Element Six have established a reproducible process for one of the largest single-crystal diamond wafers yet, at three inches. How a sapphire trick beat the cracking problem that long held back diamond, the material many call the ultimate semiconductor.
αGEL is the Japanese gel that keeps a raw egg intact after an 18-meter drop. The same material hides in mechanical pencils, G-SHOCK watches and ASICS shoes, and now damps drone vibration.
A team led by Japan's QST has shown, for the first time, a magnetic memory that writes with a laser pulse instead of current, and made it work on CoFeB, the alloy already inside commercial chips. Here's how, and why it matters for data-center power.
RIKEN and Enplas drill 1.1-micron, aspect-ratio-1,000 holes through glass in under a nanosecond, hitting 3,000 holes a second. As the chip race shifts from shrinking to packaging, here's why glass through-glass vias matter, and where Japan's materials and equipment makers fit.
Kyoto University's Takuji Hatakeyama and colleagues linked multiple-resonance units to reach a 5.5nm emission band in solution, pushing spontaneous emission toward laser-like color purity. Published in Science, it points to purer, more efficient next-gen displays.
A Japanese radiative cooling film that stays below air temperature in direct sun, with zero electricity. How SPACECOOL dumps heat into space, its 29% energy cut in Saudi trials, and why passive cooling matters as the planet warms.
Tokyo Ohka Kogyo is No. 1 in photoresist with a 24.7% share and No. 2 in EUV resist with 28%. How a 1936 maker of coal-lamp battery material became a chokepoint in the AI chip supply chain.
Sanyo Special Steel, Japan's No.1 maker of bearing steel and a world leader in steel cleanliness, will be absorbed by Nippon Steel and dissolved on April 1, 2027. The model for the famous novel The Grand Family, it once suffered postwar Japan's largest bankruptcy. Why give up the name now? A look at China's steel glut and an unexpected Swedish thread.
Intel installed the first production-grade High-NA EUV machine; TSMC bought one but kept it out of production. Being slow to the newest lithography once cost Intel a lost decade. Is TSMC repeating that mistake? Its confidence rests on Japan: Mitsui Chemicals' EUV pellicle and the HOYA/Shin-Etsu/AGC mask-blank near-monopoly (about 90% share).