Asahi Kasei's Photosensitive Polyimide Film: Japan's New Bet on AI Chiplet Packaging
Asahi Kasei has developed a photosensitive polyimide film for advanced semiconductor packaging, turning a liquid material into a laminated film, the same playbook behind ABF. We explain what it means for AI chiplet packaging, how it stacks up against US and Korean rivals, and why Japan keeps winning the materials game.